Utilizing the best processing technologies available, our products are optimised for durable performance to meet the stringent demands in the communication, consumer, computer and automotive industries. Assembly, packaging, burn-in and testing are offered as standard or special customer requests. Standard packaging includes mini-BGA, MCP services as well as, flip-chip, bare die solutions and fully tested wafers.

Pb-Free component availability.

To comply with the 2003/95/EC RoHS standards AMIC have successfully completed their 'Green Mission'. Since 2002, AMIC have performed reliability tests on packages and lead-frames to eliminate contents of environmentally hazardous substances.
For detailed information please consult AMIC data sheets and reliability manuals which are available upon request.

AMIC ROHS and PB free products are easy to recognised during transportation and storage. Their vacuum sealed packaging are labelled with our ROHS logo for easy identification.